| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an active energy ray-curable resin useful for various uses, especially for permanent masking of a printed circuit board or for producing, e.g., an interlayer insulation layer of a multilayer printed circuit board; and a photocurable thermosetting resin composition excellent in heat resistance, adhesiveness, resistance to electroless plating, resistance to moisture absorption, and PCT (pressure cooker) resistance and a cured product thereof. <P>SOLUTION: The active energy ray-curable resin is prepared by reacting a bisphenol A derivative with a compound (a) having at least one unsaturated group and an oxirane or oxetane ring. This resin is further reacted with a polybasic acid anhydride to give a carboxylated active energy ray-curable resin. The photocurable thermosetting resin composition comprises (A) the carboxylated active energy ray-curable resin, (B) a photopolymerization initiator, (C) a diluent, and (D) a polyepoxy compound. The cured product is obtained from the composition. <P>COPYRIGHT: (C)2004,JPO |
