发明名称 METHOD OF MANUFACTURING CHIP CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a chip ceramic electronic component which has stable electrical characteristics and excellent mechanical strength. SOLUTION: In the regions including positions 2 to be cut on ceramic green sheets 1a, 1b, a ceramic material contained in the ceramic green sheets and an inorganic paste 3 containing an inorganic material having a higher resistivity than that of the ceramic material are applied, and the prescribed number of the ceramic green sheets 1a, 1b are laminated to form a ceramic laminate. Then the ceramic laminate is cut into chip types at the positions to be cut, and sintered, and then external electrodes are formed on both ends of each ceramic sintered compact. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004128221(A) 申请公布日期 2004.04.22
申请号 JP20020290286 申请日期 2002.10.02
申请人 MURATA MFG CO LTD 发明人 FURUKAWA NOBORU;KAWASE MASAHIKO
分类号 H01C7/04;H01C1/028;H01C7/00;H01G2/12;H01G4/005;H01G4/12;H01G4/30;H01S4/00;H05K3/36;(IPC1-7):H01C7/04 主分类号 H01C7/04
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