| 摘要 |
PROBLEM TO BE SOLVED: To bond a bare chip to an opaque substrate or a semiconductor wafer with high precision without the need for using a high performance stage. SOLUTION: A component recognition camera 51 is used to adjust the position of a template 48 to be aligned to a chip 60 supported by a suction head 33 and an outer mark 68 of the template 48 at that time is memorized. Then the substrate 47 is moved under the suction head 33 through the movement of an X-Y stage 44, a work recognition camera 52 recognizes the outer mark 66 of the substrate 47, the position of the substrate 47 is corrected so that the mark 66 is coincident with the outer mark 68 of the template 48 having been memorized before, and the suction head 33 is descended in this state to perform mounting. COPYRIGHT: (C)2004,JPO
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