发明名称 HEATING ELEMENT COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the mass and costs of a cooling device by obtaining the same cooling capability as that of a conventional device without increasing its radiation area. SOLUTION: The heating element cooling device has heating elements 1a, 1b and 1c which are mounted on one surface of a base 2 and comb-shaped fins 3 which are formed on the other surface of the base 2 as shown in Fig.(b). A deflector 4 having at least one apex is provided between a bottom plate 5 parallel to the base 2 and tips of the fins 3. In this way, cooling fluid from a cooling fluid influx part or a suction part (left in Fig.(a))is deflected toward parts in contact with the fins 3 or its neighborhood and the cooling capability is improved by increasing the speed of the cooling fluid. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004128439(A) 申请公布日期 2004.04.22
申请号 JP20030028120 申请日期 2003.02.05
申请人 FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD 发明人 TANIGAWA TAICHI
分类号 F25D1/00;H01L23/467;H05K7/20;(IPC1-7):H01L23/467 主分类号 F25D1/00
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