发明名称 METHOD OF FORMING EXTERNAL ELECTRODE OF CERAMIC ELECTRONIC COMPONENT, AND CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a ceramic electronic component wherein the occurrence of a crescent-shaped part of an external electrode in a boundary between an element assembly and the external electrode can be suppressed, and also to provide a method of forming the external electrode. SOLUTION: The element assembly of the ceramic electronic component is dipped in a conductive paste film at a dipping speed of V1. When the element assembly reaches the bottom dead point H0, it is immediately pulled up at a pulling speed of V2. In the middle of pulling up the element assembly (in such a state that the conductive paste attached to an end part of the element assembly and the conductive paste film is still joined together), the pulling operation is stopped once. After the passage of a prescribed stop time T, the element assembly is pulled up again at a speed V3. After the conductive paste attaching to the end of the element assembly and the conductive paste film are completely separated, the element assembly is rapidly pulled up at a pulling speed of V4. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004128168(A) 申请公布日期 2004.04.22
申请号 JP20020289218 申请日期 2002.10.01
申请人 MURATA MFG CO LTD 发明人 KATAYAMA HIROMASA;MIZOI AKIRA;OGOSHI KAZUNORI;AOKI KENICHI
分类号 H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/30
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