发明名称 |
HERRICHTUNGSANORDNUNG EINER CHEMISCH-MECHANISCHEN POLIERSCHEIBE UND DAZUGEHÖRIGES VERFAHREN |
摘要 |
<p>According to an example embodiment, the present invention comprises a CMP pad conditioner arrangement. An inlet is configured and arranged for receiving treatment elements. A distribution surface is coupled to the inlet and is configured and arranged to disperse the treatment elements. A multitude of outlets are coupled to the distribution surface and are configured and arranged to dispense the treatment elements onto a CMP pad. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.</p> |
申请公布号 |
DE60008985(D1) |
申请公布日期 |
2004.04.22 |
申请号 |
DE2000608985 |
申请日期 |
2000.03.29 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN |
发明人 |
LIU, H.;VINES, LANDON |
分类号 |
B24B53/007;B24B53/013;B24B53/017;B24D13/14;B24D13/18;H01L21/304;(IPC1-7):B24B37/04;B24D7/10 |
主分类号 |
B24B53/007 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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