| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition capable of decreasing the amount of erosion. <P>SOLUTION: The composition contains (A) colloidal silica in a content higher than 50 g/L but not higher than 160 g/L, (B) at least one compound selected from among periodic acid and its derivatives, (C) ammonia, (D) ammonium nitrate, and (E) water, has a pH of 1.8-4.0, and is used in the step of finish polishing at least the metal layer and insulator layer of a wiring structure which comprises an insulator layer with surface dents and a metal layer formed on the insulator layer and containing a conductive layer formed from a conductive metal (e.g. tungsten). <P>COPYRIGHT: (C)2004,JPO</p> |
