| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a grinder composition capable of surely preventing the dry gel abrasive grains from sticking to the surface of a wafer after edge polishing, and remaining on the same surface, and a grinding method employing the composition. <P>SOLUTION: The grinder composition is prepared by sillisium dioxide, alkaline compound, water-soluble macromolecular compound and water. In this case, the D<SB>SA</SB>of the sillisium dioxide is not less than 40nm and a value obtained by dividing the D<SB>95</SB>of sillisium dioxide by the D<SB>5</SB>of the sillisium dioxide is not more than 3.8 or a value obtained by dividing a value, obtained by multiplying the D<SB>SA</SB>of sillisium dioxide by the D<SB>5</SB>of sillisium dioxide, by the D<SB>95</SB>of sillisium dioxide is not more than 0.07. <P>COPYRIGHT: (C)2004,JPO</p> |
