| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board provided with an interlayer insulating material having good embedding property of a circuit pattern and good interlayer adhesive property and interlayer insulation property. SOLUTION: In the multilayer circuit board, interlayer connection is performed by bringing one minute sharp projection 1b made in one conductive circuit layer 1a into contact with the other conductive circuit layer. Interlayer insulation is performed by a three layer structure film where a thermoplastic film 2a is inserted between a pair of thermosetting adhesion layers 2b. COPYRIGHT: (C)2004,JPO |
