发明名称 |
Wafer processing apparatus and method |
摘要 |
A method of dicing a wafer into a plurality of dies is disclosed. The wafer comprises a substrate having a surface on which at least one thin film layer is formed. The method comprises the steps of laser cutting a plurality of lines in the wafer to at least the depth of the at least one thin film layer; and saw cutting along the plurality of lines in the wafer to dice the wafer.
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申请公布号 |
US2004075717(A1) |
申请公布日期 |
2004.04.22 |
申请号 |
US20020273381 |
申请日期 |
2002.10.16 |
申请人 |
O'BRIEN SEAMUS;CORCORAN AIDAN |
发明人 |
O'BRIEN SEAMUS;CORCORAN AIDAN |
分类号 |
B23K26/38;B23K26/40;B28D1/22;B28D5/02;B41J2/16;(IPC1-7):B41J2/14;B23K26/36 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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