| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module in which the reliability of the electrode wiring of a semiconductor element is highly improved. <P>SOLUTION: This semiconductor module (100) is provided with a flat lead (30) having an electrode joining section (31) joined to the electrode of the semiconductor element (20) mounted on a substrate (10), a wiring joining section (32) joined to a wiring section (43) provided on the outside of the element (20), and a connecting section (33) which connects the sections (31) and (32) to each other. At least the electrode joining section (31) of the lead (30) is composed of a composite material obtained by wrapping a low expanding material with a highly heat-conductive material. Consequently, the heat generated from the semiconductor element is efficiently guided to the outside through the highly heat-conductive material of the electrode joining section (31) and, in addition, the differential thermal expansion between the joining section (31) and electrode is suppressed by the low expanding material. <P>COPYRIGHT: (C)2004,JPO |
