发明名称 METHOD OF MANUFACTURING CIRCUIT DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To efficiently manufacture a circuit device (SIP or ISB) constituted by coating and integrally supporting a plurality of circuit elements with and by an insulating resin. <P>SOLUTION: A user terminal 10, an ISB server 12, and an ISB mounting plant 14 are connected to each other through a communication network. A user transmits the conditions to be met by its desired ISB circuit device, such as the external size, terminal information, schematic CAD data, etc., of an ISB to the ISB server 12 by inputting the conditions from the user terminal 10. The server 12 transmits reliability evaluated results to the user terminal 10 in addition to the appointed date of delivery and cost of the ISB circuit device. Moreover, the server 12 prepares mask data used for manufacturing the ISB circuit device based on the inputted conditions and transmits the data to the ISB mounting plant 14. At the plant 14, the circuit device is manufactured upon receiving the manufacturing data from the server 12 and the manufactured circuit device is provided to the user. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004128228(A) 申请公布日期 2004.04.22
申请号 JP20020290427 申请日期 2002.10.02
申请人 SANYO ELECTRIC CO LTD 发明人 MAEHARA EIJU;SAKAMOTO JUNJI;USUI AKIRA
分类号 H01L25/00;G06F17/50;H01L21/48;H01L23/31;H01L25/04;H01L25/18;(IPC1-7):H01L25/00 主分类号 H01L25/00
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