发明名称 WÄSSRIGE ZUSAMMENSETZUNG, WÄSSRIGE SCHNEIDFLUID, VERFAHREN ZUR HERSTELLUNG UND ZUR VERWENDUNG
摘要 Provided is an aqueous cutting liquid, which suppresses impacts on not only a local working environment but the global environment, and in which high dispersibility of abrasive grains and prevention of precipitate from being formed as a hard cake are compatible. Abrasive grains G are dispersed in an aqueous composition comprising a dispersion medium M in which colloidal particles P of silicic acid are dispersed in a stable manner, the dispersion medium M being composed of a hydrophilic polyhydric alcohol compound such as ethylene glycol or the like, a lipophilic polyhydric alcohol compound such as propylene glycol or the like and water. The dispersion medium is free of smell and noninflammable. Since abrasive grains are not put into direct, close contact to each other in sedimentation over time, precipitate is not formed as a hard cake and thereby abrasive grains are again dispersed for second use. Since the aqueous cutting liquid is of low viscosity in an intrinsic sense, increases in viscosity by mixing of water or cutting chips into the cutting liquid are mild and therefore, a long lifetime of the cutting liquid is secured. Water cleaning of a work can be conducted. Since the dispersion medium is a biodegradable organic compound with a low molecular weight, a waste of the dispersion medium is treatable by activated sludge. <IMAGE>
申请公布号 DE69911549(T2) 申请公布日期 2004.04.22
申请号 DE1999611549T 申请日期 1999.04.09
申请人 SHIN-ETSU HANDOTAI CO., LTD.;OHTOMO CHEMICAL IND. CORP., TOKIO/TOKYO 发明人 KABURAGI, S.;ASHIDA, A.;KIUCHI, E.
分类号 B28D5/04;B28D5/00;C09K3/14;C10M173/02;C10N30/00;C10N30/04;C10N40/22;H01L21/304;(IPC1-7):C10M173/02;C10M125/26;B28D1/02 主分类号 B28D5/04
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