| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, with which a CSP (chip size package) having no built-in interposer can be made into a MCP (multi-chip package), and also to provide a method of manufacturing the semiconductor device. <P>SOLUTION: A first IC chip 101 having a main surface having a first pad 102 formed thereon, a protective film 103 covering the main surface of the first IC chip 101 so as to expose a part of the first pad 102, and a first face having a second pad 112 formed thereon and a second face facing the first face are provided. Further provided are a second IC chip 111 provided on the first protective film 103 so that the second face and the protective film 103 face each other, a second protective film 113 covering the first face of the second IC chip 111 so as to expose a part of the second pad 112, a conductor 115 provided on the second pad 112 and the second protective film 113 so as to be electrically connected to the second pad 112, a columnar conductor 116 provided on the conductor 115 and electrically connected to the conductor 115, a resin 130 covering the first and second protective films 103 and 113, the conductor 115, and the side face of the second IC chip 111 so as to expose an end of the columnar conductor 116. <P>COPYRIGHT: (C)2004,JPO |
