SEMICONDUCTOR PACKAGE AND ITS MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package and its mounting structure in which the reliability of a bump junction is improved against an impact load and a substrate bending load. SOLUTION: A height of an externally connecting bump is made two thirds a bump diameter or less. A low elastic layer is provided in an interconnection substrate core layer 6 of the semiconductor package 10. A reinforcing bump 17 is formed that is not connected electrically with a middle portion of the semiconductor package 10. A reinforcing resin is formed to contact a side surface of a semiconductor package and a surface of a mounting substrate. A low elastic portion is formed in a portion along the outline of the semiconductor package 10 of the mounting substrate. A structure thus made up decreases an out-of-plane deformation magnitude of semiconductor package mounting portions in a mounting substrate loaded with the semiconductor package, so that a stress of the bump junction is reduced. COPYRIGHT: (C)2004,JPO