| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which is equipped with a build-up layer only on the surface of a core board and never warped or hard to be warped and to provide a method of manufacturing the same. <P>SOLUTION: The wiring board 1 includes the core board 2 with a front surface 4 and a rear surface 5, a surface wiring layer 8 and a rear wiring layer 9 which are separately formed on the front surface 4 and rear surface 5 of the core board 2 respectively, the build-up layer BU which is formed on the surface 4 of the core board 2 and composed of insulating layers 10 and 16 and wiring layers 14 and 20 which are located between the insulating layers 10 and 16, and a back insulating layer 11 formed on the rear surface 5 of the core board 2. Furthermore, the back insulating layer 11 has, at least, one of physical properties, such as a Young's modulus of 4 Gpa or above (1), a thermal expansion coefficient (RT to Tg) of 20 ppm or above (2), an elongation of 4% or below (3), and a cure shrinkage of 1,000 ppm or above. <P>COPYRIGHT: (C)2004,JPO</p> |
