发明名称 NON-CONTACTING SENSOR MULTICHIP MODULE WITH INTEGRAL HEAT-SINKS
摘要 <p>A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and to the second portion. The second portion is pivotable about the hinge from an open position with respect to the first portion to a closed position with respect to the first portion. The assembly also includes a sensor positioned within the chamber and substantially encircled by the plurality of walls. The sensor is partially enclosed by the first portion and second portion when the second portion is in the closed position.</p>
申请公布号 WO2004034000(A1) 申请公布日期 2004.04.22
申请号 WO2003US10169 申请日期 2003.04.03
申请人 SSI TECHNOLOGIES, INC. 发明人 TOLA, JEFFREY
分类号 G01K1/14;(IPC1-7):G01D11/24 主分类号 G01K1/14
代理机构 代理人
主权项
地址