| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module in which the wiring property of an electrode of a semiconductor element and the reliability of joint parts are superior. <P>SOLUTION: The semiconductor module 100 constituted of connecting the electrode (23) of the semiconductor element (20) mounted on a substrate (10) to a wiring part (43) arranged on the outside of the semiconductor element (20) through a plate-like lead (30), is characterized in that the plate-like lead (30) is provided with an electrode junction (31) joined with the electrode (23), a wiring junction (32) joined with the wiring part (43), and a low rigidity part (33) formed at least on a part of these junctions (31), (32) and having rigidity lower than that of the periphery. Since the plate-like lead (30) is provided with the low rigidity part (33) which may be easily deformed, the lead (30) can be easily assembled and stress or the like applied to the electrode junction (32) can be reduced. <P>COPYRIGHT: (C)2004,JPO |
