CONDUCTIVE FINE PARTICLE, INTERCONNECTING METHOD OF ELECTRODE TERMINALS, AND CONDUCTIVE CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a conductive fine particle which can be used for interconnection between electrode terminals formed on a first and a second electric circuit substrates, and by which a conductive connection structure with high reliability on electrical and mechanical connection between electrode terminals, one laid upon the other, can be obtained.

SOLUTION: The conductive fine particle is composed of a spherical base material particle made of resin, a metal layer formed on the surface of the spherical base material particle, and an adhesive layer formed on the surface of the metal layer. The metal layer has a multi-layer structure composed of not less than two layers, and at least the outermost layer is a solder layer.

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