| 摘要 |
PROBLEM TO BE SOLVED: To provide a deposit extremely reduced in whisker formation in tin and tin alloy plating of copper lead frames etc., and to provide a method of depositing a tin layer or film reduced in the tendency to the formation of the whiskers. SOLUTION: The layer of the tin or tin alloy is electrodeposited on a substrate in such a manner that the crystal face forming an angle 5 to 22°with the crystal face adjacent to the tin or tin alloy layer or the face equivalent thereto does not substantially exist. Also, the tin or tin layer reduced in the formation of the whiskers is obtained by forming the layer in such a manner that the ratio of the peak intensity corresponding to the crystal face forming the angle 5 to 22°or the face equivalent thereto to the total peak intensity of all the peaks observed in X-ray diffraction spectra is≤10%. The tin or tin alloy layer and an electronic device having the same are obtained by the above method. COPYRIGHT: (C)2004,JPO |
