WIRING BOARD AND ELECTRONIC APPARATUS, AS WELL AS MANUFACTURING METHOD OF THE WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To prevent crosstalk due to signals transmitted in adjacent signal interconnections in a wiring board for transmitting a high-frequency current (signal). SOLUTION: The wiring board has interconnections (conductor patterns) formed on a front surface of an insulation substrate or on the front surface of the insulation substrate and inside it. Around predetermined signal interconnections out of those interconnections, interconnections which have the same potential and are not electrically connected with the signal interconnections are formed concentrically with the signal interconnections. COPYRIGHT: (C)2004,JPO