发明名称 MATERIAL OF INSULATING FILM BETWEEN ORGANIC GROUP LAYERS
摘要 PROBLEM TO BE SOLVED: To provide the structure of an organic macromolecular film which can sharply improve the mechanical strength of the organic macromolecular film in the case of utilizing the organic macromolecular film as an interlayer insulating film constituting a semiconductor device. SOLUTION: A benzene ring or a benzo-condensation ring is contained in the main frame of at least one material monomer as a material of an aromatic compound synthesized from a plurality of sorts of material monomers, and a material monomer in which the positions of two substituents of a benzene ring constituting a main chain are para-positions (1, 4) is selected. Therefore, higher mechanical strength can be realized as compared with ortho positions (1, 2-) or meta-positions (1, 3-). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004128277(A) 申请公布日期 2004.04.22
申请号 JP20020291505 申请日期 2002.10.03
申请人 NEC CORP;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;TOKYO ELECTRON LTD 发明人 KAWAHARA JUN;JOTO KAZUYOSHI;MIYOSHI SHUSUKE;HATA NOBUHIRO
分类号 C08G61/02;H01L21/312;(IPC1-7):H01L21/312 主分类号 C08G61/02
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