| 摘要 |
PROBLEM TO BE SOLVED: To improve joining strength by inhibiting decrease in the thickness of terminals in electronic component parts equipped with terminals whose main component is Ag. SOLUTION: A solder alloy is used which contains 3.0-5.0% Ag and 1.0% or less Cu in mass %, with the balance substantially composed of Sn, and which satisfies a relation between the Ag concentration C<SB>Ag</SB>and Cu concentration C<SB>Cu</SB>in the solder alloy as 2.0C<SB>Ag</SB>+ 1.2C<SB>Cu</SB>≥7.0. By soldering the terminals having Ag as the main component, the decrease in the thickness of terminals is reduced in electronic component parts. The solder alloy desirably contains, in mass %, 10% or less Bi, or 5.0% or less In. Further, it is preferable that the solder alloy contains one or more kinds elements having 1.0% or less in total mass % selectable from Al, Ni, Au, Sb, P and Zn. COPYRIGHT: (C)2004,JPO
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