发明名称 |
Wafer processing method |
摘要 |
A wafer processing method for use with a wafer processing apparatus having a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto the liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck. The method enables performance of wafer processing while letting a wafer be mounted on the ceramic plate by a wafer transport. The method includes causing the wafer transport to transport the wafer onto the ceramic plate, pre-heating the wafer while the wafer is held on the ceramic plate for a predetermined length of time, and mounting the preheated wafer on the ceramic plate.
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申请公布号 |
US2004076411(A1) |
申请公布日期 |
2004.04.22 |
申请号 |
US20030658281 |
申请日期 |
2003.09.10 |
申请人 |
KANNO SEIICHIRO;YOSHIOKA KEN;NISHIO RYOJI;KANAI SABUROU;KIHARA HIDEKI;OKUDA KOJI |
发明人 |
KANNO SEIICHIRO;YOSHIOKA KEN;NISHIO RYOJI;KANAI SABUROU;KIHARA HIDEKI;OKUDA KOJI |
分类号 |
H01L21/00;H01L21/683;(IPC1-7):F27B5/14 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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