发明名称 |
Method and apparatus for sealing electrical contacts during an electrochemical deposition process |
摘要 |
An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.
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申请公布号 |
US2004074762(A1) |
申请公布日期 |
2004.04.22 |
申请号 |
US20020274722 |
申请日期 |
2002.10.18 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
KEIGLER ARTHUR;HERCHEN HARALD;BURKHART VINCENT E.;TRINH SON N. |
分类号 |
C25D7/12;C25D17/06;(IPC1-7):C25D17/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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