<p>A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.</p>
申请公布号
WO2004034529(A1)
申请公布日期
2004.04.22
申请号
WO2003JP12439
申请日期
2003.09.29
申请人
SANYO ELECTRIC CO., LTD.;TOTTORI SANYO ELECTRIC CO., LTD.;MATSUMOTO, AKIHISA;MOTOIKE, TATSUYA;NAKAHARA, TOSHINORI