| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer semiconductor device which can test while chips are laminated and which can prevent a yield from decreasing and an excess circuit from increasing. <P>SOLUTION: The multilayer semiconductor device is obtained by laminating a predetermined semiconductor integrated circuit chip 20 and at least one or more semiconductor integrated circuit chips 30<SB>1</SB>, 30<SB>2</SB>except the predetermined chip. At least one or more chips include a group made of a plurality of circuit blocks. The predetermined chip includes a storage unit for storing defective information for specifying a defective circuit block when the defective block is included in the group, and a replacing circuit for replacing the defective circuit block. <P>COPYRIGHT: (C)2004,JPO |
