| 摘要 |
A main unit casing assembly for electronic products is provided, including a casing and a plurality of body panels. The body panels are directly assembled to the casing to cover the casing and form a containing space, thereby not having to use a top casing of a main unit of the electronic product in the prior art. The use of this casing assembly can reduce the thickness of the casing assembly while still maintaining structural strength of the casing assembly, making the electronic product with such a casing assembly more compact in size.
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