发明名称 |
Resin-moulded semiconductor device with heat radiating electrode |
摘要 |
A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24). <IMAGE> |
申请公布号 |
EP1199746(A3) |
申请公布日期 |
2004.04.21 |
申请号 |
EP20010302527 |
申请日期 |
2001.03.20 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
SAKAMOTO, NORIAKI;KOBAYASHI, YOSHIYUKI;SAKAMOTO, JUNJI;OKADA, YUKIO;IGARASHI, YUSUKE;MAEHARA, EIJU;TAKAHASHI, KOUJI |
分类号 |
H01L23/42;H01L21/48;H01L21/56;H01L23/31;H01L23/433;H05K1/02;H05K1/18 |
主分类号 |
H01L23/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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