| 摘要 |
<p>PURPOSE: A printed circuit board, a mounting structure for semiconductor device having bumps, an electro-optic device, and an electronic device are provided to reduce short circuit due to a printing error of a soldering material by widening a gap between a pad and a wire. CONSTITUTION: A printed circuit board includes a plurality of pads, and a plurality of wires. A semiconductor device having bumps is mounted on the pads(413a). The wires(411) are drawn from each of the pads. The printed circuit board further includes a region where a pitch of the longitudinal direction of the pads and a pitch of the lateral direction of the pads are different from each other. The printed circuit board further includes a plurality of wires which are drawn from a wider pitch side of the longitudinal direction of the pads and the lateral direction of the pads.</p> |
