Laminated structure for electronic equipment and method of electroless gold plating

摘要

A laminated structure for electronic equipment includes a printed circuit board (11) having copper foil (12), an undercoat plating layer (13) made of tin or silver, formed on the printed circuit board (11), and a gold plating layer (14) formed on the undercoat plating layer (13) by electroless plating. Tin or silver is a metal which acts as an anticatalyst in electroless plating. After formation of the undercoat plating layer (13), the printed circuit board (11) is dipped in catalyst-applying treating liquid to inhibit the anticatalyst.