| 摘要 |
<p>Optical semiconductor package and its method of fabrication, which package comprises a semiconductor component ( 6 ), a rear face of which is attached to a front face of a mounting and electrical connection support ( 2 ) and a front face of which comprises an optical sensor ( 9 ), means ( 11 ) for electrically connecting the semiconductor component to the support, a transparent chip ( 12 ) placed in front of the semiconductor component, which lies at least in front of the optical sensor, and encapsulation means ( 21 ) comprising an encapsulation material which envelopes, in front of the support, the periphery of the semiconductor component and of the chip, without covering at least the central part of the front face of this chip.</p> |
