发明名称 |
Method and apparatus for reduced pin count package connection verification |
摘要 |
A method and apparatus for testing the chip-to-package connectivity of a common I/O of a semiconductor chip is disclosed which uses reduced pin count testing methods. The method includes driving a test signal transition onto a control pad of a semiconductor chip with a weak driver and comparing the transition rise time with a threshold value. For an I/O with a faulty chip-to-package connection, the rise time is much faster than for an I/O with a completed chip-to-package connection. Additional impedances may also be added to the tester fixturing to increase the sensitivity of the test equipment to the capacitance of the I/O connections.
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申请公布号 |
US6724210(B2) |
申请公布日期 |
2004.04.20 |
申请号 |
US20010682345 |
申请日期 |
2001.08.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COMBS MICHAEL L.;WHEATER DONALD L. |
分类号 |
G01R31/28;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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