Thin film deposition method including using atomic layer deposition without purging between introducing the gaseous reactants

摘要

The present invention discloses a method of fabricating a thin film in a chamber where a heater and a suscepter are located. The method includes the steps of disposing an object on the susceptor so as to form the thin film thereon; heating the object; a first sub-step of introducing a first gaseous reactant into the first chamber such that the first gaseous reactant is absorbed on the object to form an absorption layer; a second sub-step of introducing a second gaseous reactant into the first chamber such that the second gaseous reactant reacts with the absorption layer absorbed on the object; and a third sub-step of introducing a reducing gas into the first camber such that the reducing gas reduces by-products and impurities of the first and second gaseous reactants.