发明名称 |
METHOD AND APPARATUS FOR ASSESSING AND RESTORING SOLDERABILITY |
摘要 |
A sequential electrochemical reduction method and apparatus are provided for assessing and restoring solderability of electronic component leads. The method detect s and quantifies the presence of metallic oxides that are detrimental to solderability by sequential electrochemical reduction in contact with an electrolyte in an inert atmosphere. A cathode having a high hydrogen overvoltage is placed in contact with the electrolyte. A solderable portion of the component to be tested is placed in contact with the cathode and the electrolyte. An inert counter electrode and a reference electrode are also placed in contact with the electrolyte. A current is passed between the cathode and inert electrode, and the voltage a nd current are measured as a function of time during reduction of metallic oxides on the solderable portions of the component. The measurements of voltage, current, time, and charge densit y may be compared with baseline data from specimens having known oxide compositions that correlate with degradation of solderability.
|
申请公布号 |
CA2105493(C) |
申请公布日期 |
2004.04.20 |
申请号 |
CA19932105493 |
申请日期 |
1993.09.03 |
申请人 |
ROCKWELL INTERNATIONAL CORPORATION |
发明人 |
TENCH, D. MORGAN;ANDERSON, DENNIS P. |
分类号 |
B23K1/20;G01N27/416;G01N27/42;G01N27/48;H05K3/07;H05K3/22;H05K3/34;(IPC1-7):G01N27/42 |
主分类号 |
B23K1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|