发明名称 |
Semiconductor memory with source/drain regions on walls of grooves |
摘要 |
A process for producing a semiconductor memory device comprises the steps of: (a) forming a floating gate on a semiconductor substrate having a dielectric film; (b) forming a side wall spacer comprising an insulating film on a side wall of the floating gate; (c) forming a groove by etching the semiconductor substrate using the side wall spacer as a mask; and (d) forming a low concentration impurity layer from one side wall to a bottom surface of the groove by an oblique ion implantation to the semiconductor substrate thus resulting, and forming a high concentration impurity layer from the other side wall to the bottom surface of the groove by in inverse oblique ion implantation.
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申请公布号 |
US6724035(B2) |
申请公布日期 |
2004.04.20 |
申请号 |
US20000733031 |
申请日期 |
2000.12.11 |
申请人 |
SHARP KABUSHIKI KAISHA;MASUOKA FUJIO |
发明人 |
FUJIO MASUOKA;TANIGAMI TAKUJI;WADA YOSHIHISA;TANAKA KENICHI;SHIMIZU HIROAKI |
分类号 |
G11C16/04;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/108;H01L29/76 |
主分类号 |
G11C16/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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