发明名称 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
摘要 |
Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp<2 >type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a beta-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
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申请公布号 |
US6723452(B2) |
申请公布日期 |
2004.04.20 |
申请号 |
US20020196222 |
申请日期 |
2002.07.17 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KIMURA YASUO;TOMIYOSHI KAZUTOSHI;SHIMODA TAROU;ASANO EIICHI;AOKI TAKAYUKI;SHIOBARA TOSHIO |
分类号 |
C08G59/20;C08G59/24;C08G59/32;C08L63/00;H01L23/29;(IPC1-7):H01L29/12 |
主分类号 |
C08G59/20 |
代理机构 |
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代理人 |
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