| 发明名称 |
Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer |
| 摘要 |
Distribution of machining ability in periphery surface is grasped and evaluated through measuring the machined depth at several positions of the peripheral portion by use of a wafer for the evaluation of the ability of machining the peripheral portion thereof.
|
| 申请公布号 |
US6722954(B2) |
申请公布日期 |
2004.04.20 |
| 申请号 |
US20010914298 |
申请日期 |
2001.12.06 |
| 申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
HASHIMOTO TAKAHIRO;MIZUSHIMA KAZUTOSHI |
| 分类号 |
B24B1/00;B24B9/06;H01L23/544;(IPC1-7):B24B1/00 |
主分类号 |
B24B1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
