发明名称 |
BONDING DEVICE AND METHOD |
摘要 |
A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surfaces of the metal bonding portions at a depth of 1.6 nm or more over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in an atmospheric air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the atmospheric air, thereby significantly simplifying the bonding process and the whole device and lowering the cost. |
申请公布号 |
AU2003266557(A1) |
申请公布日期 |
2004.04.19 |
申请号 |
AU20030266557 |
申请日期 |
2003.09.22 |
申请人 |
TORAY ENGINEERING CO., LTD.;SUGA, TADATOMO |
发明人 |
AKIRA YAMAUCHI;TADATOMO SUGA;TOSHIHIRO ITO |
分类号 |
B23K20/00;H01L21/60 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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