发明名称 |
SOLDER-COATED BALL AND METHOD FOR MANUFACTURE THEREOF, AND METHOD FOR FORMING SEMICONDUCTOR INTERCONNECTING STRUCTURE |
摘要 |
A solder ball 50 according to the present invention includes a spherical core 2 and a solder layer 4, which includes Sn and Ag and which is provided so as to wrap the core 2 up. The amount of water contained in the solder layer 4 is 100 mu l/g or less when represented by the amount of water vapor in standard conditions. <IMAGE> |
申请公布号 |
AU2003266588(A1) |
申请公布日期 |
2004.04.19 |
申请号 |
AU20030266588 |
申请日期 |
2003.09.24 |
申请人 |
SUMITOMO SPECIAL METALS CO., LTD. |
发明人 |
MASUO KONDO;FUMIAKI KIKUI |
分类号 |
B23K35/02;H01L23/485;H01L23/498;H05K3/34 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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