| 摘要 |
PURPOSE: An electrostatic chuck having a discharge path and semiconductor etching equipment having the same are provided to be capable of removing residual charges of an etched wafer. CONSTITUTION: An electrostatic chuck having a discharge path is provided with a head(102) having an electrode(103) at its inner portion and a conductive discharge plate(201) exposed to the outside at the upper portion of the head. Wafer etching equipment includes an RF(Radio Frequency) generation part(106) for supplying energy to gas in order to generate plasma, an impedance matching part(107) for minimizing the reflection of the RF power supplied from the RF generation part, a voltage control part(108b), and the electrostatic chuck. At this time, the electrode and the discharge plate are electrically connected to the voltage control part, wherein the voltage control part is used for connecting the discharge plate to the ground in the off-state of the equipment.
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