APPARATUS FOR FABRICATING PLATING PREVENTING SILICON PAD USED IN PLATING LEADFRAME

摘要

PURPOSE: An apparatus for fabricating a plating preventing silicon pad used in plating a leadframe is provided to fabricate a silicon pad that has a uniform density and a reduced flaw on its surface by preventing air bubble from mixing with silicon liquid hardened in a die. CONSTITUTION: A stirrer(21) stirs silicon liquid to remove air bubbles. At least one die(23) includes a space part, an injection hole and an exhaust hole. The silicon liquid is injected into the space part and is molded. The silicon liquid is injected to the space part through the injection hole. The surplus silicon liquid in the space part is exhausted through the exhaust hole. The die is installed in a chamber(22). A pressure control unit controls the pressure in the chamber. The injection hole of the die and the stirrer are connected by a supply pipe(24). At least one valve(25,26) is installed on the supply pipe to control the silicon liquid injected to the injection hole.