| 摘要 |
1,176,584. Semi-conductor devices. WESTINGHOUSE ELECTRIC CORP. 31 July, 1968 [11 Aug., 1967], No. 36429/68. Heading H1K. A rigid conductive member 52 extends through the top 48 of an encapsulation for a semi-conductor wafer 12 and urges a resilient conductive member 38 into contact with the wafer 12. The resilient member, which may be 0-shaped or S-shaped, is soldered to the wafer 12, which is in turn soldered to a conductive base 28, e.g. through a layer 24 of Mo, W, Ta or alloys thereof. The solder used may be soft, e.g. Pb-based, or hard, e.g. Au- or Ag-based. The resilient member 38 may be of a Cu alloy, phosphor bronze or Be/Cu. |
