METHOD OF MANUFACTURING CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem wherein a multilayered wiring structure is hardly provided to a semiconductor device, and an insulating resin sheet is markedly warped in a manufacturing process of the semiconductor device which is composed of a support board of a flexible sheet with a conductive pattern and a semiconductor element mounted on the support board and all sealed up with resin.

SOLUTION: A first thin conductive film 11 and a thick second conductive film 12 are laminated into a laminated board 10 with a third conductive film 13 interposed between them. The laminated board 10 is used. After a fine conductive pattern layer 11A is formed by etching the first thin conductive film 11, the third conductive film 13 is subjected to over-etching through the conductive pattern layer 11A as a mask to form an anchor part 15, and an insulating adhesive layer 16 and a sealing resin layer 22 are firmly joined to the conductive pattern layer 11A as the insulating adhesive layer 16 and the sealing resin layer 22 are made to bite into the anchor part 15.

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