发明名称 |
CUTTING METHOD FOR PREPREG |
摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method for prepreg which cuts the prepreg while preventing generation of cut chips without movement of irradiation point of laser light and a cutting blade and also prevents carbonization of a resin of a central part of a laser light irradiation point. SOLUTION: The cutting method for the prepreg 1 comprises irradiating the prepreg 1 with the laser light L in a fixed irradiation position 6 while feeding the prepreg 1, heating a part of the prepreg 1 resin irradiated with the laser light L and softening it, and cutting the softened part of the prepreg 1 resin with a cutting blade 2 while feeding the prepreg 1. An optical system 6 for leveling intensity variation of the laser light L emitted from a laser oscillator 4 is arranged to irradiate the prepreg 1 with the laser light L which passes through the optical system 6. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004114185(A) |
申请公布日期 |
2004.04.15 |
申请号 |
JP20020278341 |
申请日期 |
2002.09.25 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
WADA TSUKUO;WATANABE HIROKI |
分类号 |
B26D7/10;(IPC1-7):B26D7/10 |
主分类号 |
B26D7/10 |
代理机构 |
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主权项 |
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地址 |
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