发明名称 CUTTING METHOD FOR PREPREG
摘要 PROBLEM TO BE SOLVED: To provide a cutting method for prepreg which cuts the prepreg while preventing generation of cut chips without movement of irradiation point of laser light and a cutting blade and also prevents carbonization of a resin of a central part of a laser light irradiation point. SOLUTION: The cutting method for the prepreg 1 comprises irradiating the prepreg 1 with the laser light L in a fixed irradiation position 6 while feeding the prepreg 1, heating a part of the prepreg 1 resin irradiated with the laser light L and softening it, and cutting the softened part of the prepreg 1 resin with a cutting blade 2 while feeding the prepreg 1. An optical system 6 for leveling intensity variation of the laser light L emitted from a laser oscillator 4 is arranged to irradiate the prepreg 1 with the laser light L which passes through the optical system 6. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004114185(A) 申请公布日期 2004.04.15
申请号 JP20020278341 申请日期 2002.09.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 WADA TSUKUO;WATANABE HIROKI
分类号 B26D7/10;(IPC1-7):B26D7/10 主分类号 B26D7/10
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