发明名称 |
Bump pad design for flip chip bumping |
摘要 |
Bump pads for flip chips in the packaging of semiconductor integrated circuits. The bump pads are each polygon-shaped and may be provided with multiple bonding apertures, in the form of slots or openings, to improve adhesion of solder bumps to the pads in the assembly of the flip chips. The edges of the flip chip may be provided with multiple interlock fingers and interlock slots which mate with respective interlock slots and fingers in the dielectric layer surrounding the pad in the chip.
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申请公布号 |
US2004070079(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20020267769 |
申请日期 |
2002.10.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HUANG TAI-CHUN;LEE TZE-LIANG |
分类号 |
H01L23/485;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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