| 发明名称 |
Preparing a wafer for electroplating |
| 摘要 |
A wafer is prepared for electroplating via a spin, rinse and dry process performed on the wafer prior to electroplating. The process may be performed in a standalone tool or may be performed in a preclean module integrated into an electroplating tool.
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| 申请公布号 |
US2004069644(A1) |
申请公布日期 |
2004.04.15 |
| 申请号 |
US20020260363 |
申请日期 |
2002.09.30 |
| 申请人 |
NELSEN DAVID C.;RASTOGI RAJIV |
发明人 |
NELSEN DAVID C.;RASTOGI RAJIV |
| 分类号 |
C25D5/34;C25D7/12;H01L21/00;H01L21/306;H01L21/321;H01L21/768;(IPC1-7):C25D5/34;C25D5/00 |
主分类号 |
C25D5/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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