| 摘要 |
<p>A method of electroless plating which comprises supplying an electroless plating solution, and then placing the plating solution under a condition for accelerating a reaction to thereby start the formation of a plated coating. In the step of supplying the electroless plating solution, no or little plated coating is formed, which allows the improvement of the uniformity of the resultant electrolessly plated coating, through supplying the plating solution over whole the surface of a substrate before the start of regular formation of the plated coating.</p> |
