| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connected substrate which has small burrs, and is hard to break in airtight sealing, with a small and thin size, and to provide its manufacturing method and a ceramic package. <P>SOLUTION: In the connected substrate composed of a plurality of mutually connected ceramic packages each comprising an insulating substrate composed of a substrate bottom on which electric elements are mounted and a substrate mound which is integrally formed on the periphery of the substrate bottom, conductive layers arranged inside and/or on the insulating substrate, and a metallized layer which is arranged at least on a part of the substrate mound for bonding a metallic lid thereto, the connected substrate has notch grooves arranged between the ceramic packages to separate the ceramic packages. The insulating substrate is composed of an alumina-based sintered compact containing a sintering agent of not less than 4 mass%, and the average particle diameter of crystal of the alumina-based sintered compact is 1-2 μm, with fracture toughness of 3.5-4.5 MPam<SP>1/2</SP>. <P>COPYRIGHT: (C)2004,JPO |
