| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is capable of restraining a short circuit from occurring between a bonding wire and inner leads and highly dependable, and to provide its manufacturing method, a circuit board and an electronic apparatus. <P>SOLUTION: The semiconductor device comprises inner leads 30 which are each provided with a sloped part 32 that is inclined upward in an outward direction; a die pad 14; a semiconductor chip 10 which is bonded on the die pad 14 and equipped with a plurality of electrodes 12; wires 16 which electrically connect the inner leads to the electrodes 12 respectively; a sealing part 18 which seals the inner leads 30, the semiconductor chip 10, and the wires 16; and outer leads 40 extending outward from the sealed part 18. <P>COPYRIGHT: (C)2004,JPO |
